Establishing “An Advanced Glass Substrate-Based Semiconductor Packaging and Manufacturing Unit”, at IDCO Plot No. S1-IT-02, Rev Plot No. 255 (P), 258 (P) & 320/509 (P) Rev. Khata No. 166/87, Revenue Village: Goudakasipur, Dist: Khordha, Tahasil: Jatni, State: Odisha by M/s. Heterogenous Integration Packaging Solutions Private Limited over an area 10.1171 Ha (25 Acre).
What is this clearance for?
The project is for constructing an industrial building for an Advanced Glass Substrate-Based Semiconductor Packaging and Manufacturing Unit at IDCO Plot No. S1-IT-02, Rev Plot No. 255 (P), 258 (P) & 320/509 (P) Rev. Khata No. 166/87, Revenue Village: Goudakasipur, Dist: Khordha, Tahasil: Jatni, State: Odisha. It involves a total built-up area of 60,838.13 Sq.mt. over an area of 10.1171 Ha (25 Acres).
Who it concerns
M/s Heterogenous Integration Packaging Solutions Private Limited (project proponent) and SEIAA, Odisha (granting authority)
Key facts & conditions
- Clearance status: Granted
- Area involved: 10.1171 Ha (25 Acres)
- Built-up area: 60,838.13 Sq.mt.
- Conditions: Construct drain within 2 years, GreenBelt Plantation (2.582 Ha, 6550 trees), Power saving (min 5%), EMC with qualified staff, STP (50KLD) & ETP (3785KLD), ZLD, Fire safety permissions, Occupational health monitoring, Solid waste management, Air pollution control devices, Water drawl permission
| Source body | PARIVESH — Environmental & Forest Clearances (MoEFCC) |
| Reference number | SIA/OR/INFRA2/582359/2026 |
| Status | closed (section: clearance) |
| Year | 2026 |
| Closing date | — |
| Documents | 1 |
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Documents
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